Featured Data Center Engineering News

Dow launches 12 W/m·K thermal gel for 800G/1.6T optical modules

May 29, 2026

Microchip ships 3.3 kV SiC power modules for solid-state transformers in AI data centers

May 27, 2026

Wolfspeed launches 3.3 kV SiC power modules for 2 kV+ DC-link systems

May 27, 2026

Toshiba ships 1200V trench-gate SiC MOSFET samples for AI data centers

May 27, 2026

Engineering Deep Dives

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Latest News

Dow launches 12 W/m·K thermal gel for 800G/1.6T optical modules

May 29, 2026

Microchip ships 3.3 kV SiC power modules for solid-state transformers in AI data centers

May 27, 2026

Broadcom samples 50G PON gateway SoC with integrated NPU and Wi‑Fi 8 support

May 27, 2026

Wolfspeed launches 3.3 kV SiC power modules for 2 kV+ DC-link systems

May 27, 2026

Toshiba ships 1200V trench-gate SiC MOSFET samples for AI data centers

May 27, 2026

Supermicro, Krambu and Endor team on liquid-cooled AI data centers with waste heat recovery

May 26, 2026

Accelsius ships NeuCool IR150 two-phase direct-to-chip rack cooling, 150kW

May 25, 2026

Hybrid optoelectronic AI computing architecture claims no active cooling needed

May 25, 2026

Cadence and TSMC expand certified design flows for N3, N2, A16 and A14 AI silicon

May 25, 2026

ROHM ships 0.24 pF ESD protection diodes for 10+ Gbps interfaces

May 25, 2026

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Sarcina launches UCIe 2.0 packaging IP for 32 GT/s chiplet interconnects

May 22, 2026

FS D5110 data center interconnect adds ZTP, up to 16T DWDM over 120 km

May 22, 2026

PCIe 7.0 clock generator delivers sub-30 fs jitter, 6 outputs

May 22, 2026

Dow launches coolant care network for liquid-cooled data centers

May 22, 2026

Celestica DS6000 1.6TbE switches now available to order for AI fabrics

May 22, 2026

3 MW demo shows 100% hydrogen backup power for data centers

May 22, 2026

Airsys seeks pilots for LiquidRack rack-level liquid cooling up to 80 kW/rack

May 21, 2026

Lumai Iris Nova optical inference server targets 90% lower AI power use

May 21, 2026

MicroLED optical interconnect targets GPU links to replace copper wiring

May 21, 2026

TDK ships 3 A micro POL power module in 2.5 × 2.5 mm for AI edge systems

May 21, 2026