Montage launches PCIe 6.x and CXL 3.x active electrical cables for multi-rack data center interconnects February 12, 2026
DCX announces 8.15 MW facility-scale CDU for 45 C warm-water AI data center cooling February 12, 2026
Options deploys direct-to-chip liquid-cooled high-density cage in Equinix NY5 data center February 12, 2026
ATX Networks gets UL 1973 certification for Areca hybrid supercapacitors for data center and telecom backup power February 12, 2026
Saitech delivers Supermicro B300 NVIDIA Blackwell AI servers with data center liquid cooling, power and rack-ready design February 12, 2026
Montage launches PCIe 6.x and CXL 3.x active electrical cables for multi-rack data center interconnects February 12, 2026
DCX announces 8.15 MW facility-scale CDU for 45 C warm-water AI data center cooling February 12, 2026
Options deploys direct-to-chip liquid-cooled high-density cage in Equinix NY5 data center February 12, 2026
ATX Networks gets UL 1973 certification for Areca hybrid supercapacitors for data center and telecom backup power February 12, 2026
Saitech delivers Supermicro B300 NVIDIA Blackwell AI servers with data center liquid cooling, power and rack-ready design February 12, 2026
Airedale by Modine launches TurboChill 3+MW hybrid air-cooled chiller for AI data center cooling February 9, 2026
ADLINK ships Express-PTL COM Express modules with Intel Core Ultra Series 3 for edge AI February 9, 2026
PacketFabric and Massed Compute plan integrated GPU-as-a-Service and network-as-a-Service for enterprise AI February 6, 2026
