Omni Design unveils 64GSPS ADC on TSMC 3nm process to boost data center and server performance

Omni Design Technologies has announced the tape out of its ODT-ADS-7B64G-3T, a 64 gigasample per second (GSPS) analog-to-digital converter (ADC) using TSMC’s 3-nanometer process. This ultra-high-speed time-interleaved ADC supports both 7- and 8-bit output modes and is designed to meet the speed and performance requirements of next-generation high-speed data communication applications, with a focus on optical networking and the upcoming PCI Express (PCIe) Generation 7 standard.

According to Omni Design, the ODT-ADS-7B64G-3T targets data center and artificial intelligence workloads where higher data throughput and efficient interconnect are critical. The device features 6 bits effective number of bits (ENOB) for input frequencies below 16 gigahertz, and greater than 5.2 bits at 32 gigahertz, providing a balance between speed and resolution for high-bandwidth SerDes and data acquisition systems commonly deployed in modern data centers.

Built on the 3-nanometer process from TSMC, the ADC is engineered for high performance and power efficiency. The company reports nominal power consumption of 185 milliwatts at 64 GSPS, with power use scalable according to sampling rate. Integrated features include built-in calibration to correct time-interleaving artifacts and an ultra-low-jitter clock distribution network, with internal ADC aperture jitter specified at 50 femtoseconds root mean square (rms).

In addition to its data center focus, Omni Design says the new ADC is suited for software-defined radio, broadband communications, and wideband satellite receivers.

“The relentless growth of data is driving the need for faster and more efficient connectivity solutions,” said Dr. Kush Gulati, President and CEO of Omni Design Technologies. “Our new 64 GSPS ADC is a testament to our commitment to innovation, providing our customers with the critical technology needed to develop products for emerging standards like PCIe Gen 7. By delivering industry-leading speed in TSMC’s advanced 3nm process, we are empowering our customers to build highly differentiated SoCs that will define the next wave of high-performance computing, communications, and AI.”

Source: Omni Design Technologies

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