DayOne Data Centers, a Singapore-headquartered hyperscale data center platform, has announced definitive agreements for over $2 billion in Series C equity financing. DayOne says the round will fund its next phase of expansion across Europe and Asia-Pacific, with an emphasis on delivering high-density, AI-ready capacity for hyperscale and cloud demand.
DayOne reports the Series C round was led by existing investor Coatue, with additional participation including the Indonesia Investment Authority (INA). DayOne says the investor mix included participants from the United States, Europe, and Asia-Pacific, and that the round was priced at a 100 percent premium to the prior round. DayOne also noted prior funding of an aggregate US$1.9 billion across Series A and Series B equity rounds in 2024, plus an up to €1 billion mezzanine debt facility secured in 2025 from Brookfield and a sovereign investor.
In Europe, DayOne says the proceeds are expected to advance its Finland platform, centered on major hyperscale campuses in Lahti and Kouvola. In Asia-Pacific, DayOne says it plans to deploy capital to continue scaling across the SIJORI (Singapore–Johor–Riau Islands) region—Singapore, Johor, and Batam—and to support growth in Thailand, Japan, and Hong Kong.
DayOne says these investments are intended to support secured customer commitments of approximately 1 GW. DayOne also describes its portfolio as targeting next-generation compute requirements via high-density, liquid-cooling–enabled designs; renewable and low-carbon power pathways; and rapid-deployment prefabricated models supported by utility and government partnerships.
Source: DayOne Data Centers
