Microchip has announced the MCPF1525 Power Module, a highly integrated 16 V Vin buck converter designed to increase power density for AI server and high-performance computing designs. Microchip says the module delivers 25 A DC-DC per device and can be stacked up to 200 A, aiming to push more power into the same rack space while keeping control and telemetry accessible through programmable PMBus and I2C.
The company positions the MCPF1525 for powering the latest generation of PCI Express switches and high-performance compute microprocessor unit (MPU) applications used in AI deployments. Microchip says the device uses an “innovative vertical construction” intended to maximize board-space efficiency, and it reports up to a 40 percent board-area reduction versus other solutions. The module measures approximately 6.8 mm x 7.65 mm x 3.82 mm, targeting space-constrained AI servers.
For monitoring and protection, Microchip says the MCPF1525 reports multiple diagnostic functions over PMBus, including over-temperature, over-current, and over-voltage protection. The company also notes a thermally enhanced package and an operating junction temperature range of -40 C to +125 C. An on-board embedded electrically erasable programmable read-only memory (EEPROM) is included to program the default power-up configuration.
Microchip also says the module integrates a customized inductor to reduce conducted and radiated noise, with the stated goal of improving signal integrity, data accuracy, and reliability in high-speed computing systems.
Microchip lists pricing at $12.00 each in 1,000-unit quantities, with purchasing available directly from Microchip, sales representatives, or authorized distributors.
Source: Microchip
