Ferric has announced the release of its Fe1766 Integrated Voltage Regulator (IVR), a device aimed at addressing the increasing power requirements of data center AI processors and other advanced electronics. Ferric claims the Fe1766 delivers 160 A from a 35.5 mm² silicon footprint and includes a fully integrated inductor, making it compact enough for integration within processor packages.
Key specifications cited by Ferric include a current density greater than 4.5 A/mm² and a regulation bandwidth exceeding 10 MHz, over ten times faster than conventional multiphase approaches, according to the company. The Fe1766 provides three times the power per area and over 20 times the power per volume compared to competing solutions. The device supports a scalable vertical power delivery network (PDN) architecture, and Ferric states deploying 64 units can achieve power delivery exceeding 10 kW.
Ferric emphasizes applications in data center infrastructure, particularly for next-generation AI processors where individual chips may require more than 5 kW, as well as for other power-intensive electronics. The Fe1766 is currently being integrated by leading processor developers to address the needs of modern kilowatt-class computing platforms.
According to Ferric, the Fe1766’s high efficiency and ability to deliver power within the processor package can reduce energy losses and free up space at the board and system level, directly supporting increased computational density in data centers.
“This launch represents a major milestone in Ferric’s mission to push the boundaries of power density and efficiency,” said Noah Sturcken, Ferric CEO. “With the Fe1766, we’re enabling the AI and computing industry to move faster, smarter, and more sustainably — solving both the chip-level bottleneck and the system-level PDN challenge in one breakthrough.”
Ferric notes this launch sets the foundation for its next-generation roadmap, aiming to further advance current density, conversion efficiency, voltage range, and control bandwidth for data center and computing applications.
Source: Ferric
