Gemtek introduced the AiPhoton 1.6T OSFP transceiver for hyperscale AI data centers, built in collaboration with NewPhotonics. The module is based on NewPhotonics’ NPG10204 DR8 photonic integrated circuit (PIC) with a transmitter-on-chip design.
Gemtek describes the AiPhoton as a 1.6 Tbps DR8 OSFP module aimed at scale-out interconnect deployments. The design uses an octal-channel architecture with 224 Gbps per lane and targets 200G-per-channel single-mode PAM4 (IMDD). NewPhotonics’ PIC integrates the laser and modulator in a multi-channel monolithic device, with Gemtek pointing to low power and improved signal integrity as key attributes for these link speeds.
A notable engineering detail is the packaging and assembly approach. The companies say the PIC uses a highly integrated flip-chip method intended to eliminate complex optical assembly and wire-bonding steps. If that holds up in production, it could matter as much as the line rate: manufacturability and yield maturity are often what separate a “1.6T” spec sheet from optics you can actually deploy at volume without unpleasant reliability surprises.
“With the introduction of AiPhoton we are well-positioned to meet the hyperscaler shift into high-volume demand for 1.6T pluggables,” said James Lee, President of Gemtek, adding that automated manufacturing combined with the NewPhotonics PIC is intended to support “fast, reliable time-to-market production.” NewPhotonics SVP and GM of Optical Connectivity Doron Tal said the companies are combining “laser-integrated PIC” technology with “high-volume manufacturing capabilities” to deliver “power-efficient 1.6T connectivity for AI infrastructure,” and described it as “a new class of 200G-per-lane pluggables designed to meet the market’s urgent need for 1.6T optics at hyperscale.”
Source: Gemtek
