Tag: Silicon Photonics

PCIe 7 signal conditioning portfolio spans copper and optical links for AI racks

October 9, 2026

Snap-Beam CPO connector for PIC-to-fiber links wins ECOC 2026 award

October 1, 2026

Coherent PhotonLink integrated optics platform targets CPO and NPO for AI data centers

September 29, 2026

100 GHz BiCMOS TIA sampling targets 200G/lane AI data center optics

September 29, 2026

Optical circuit switching prototypes target AI data center fabrics, UTStarcom says

September 25, 2026

Teradyne Iris 100 brings production microLED optical test to AI interconnects

September 25, 2026

Semtech joins XPO MSA with 200G/lane driver and TIA ICs for AI optics

September 25, 2026

3.2T near-packaged optics uses glass substrate to cut AI switch power 50%

September 25, 2026

Fiber-to-PIC coupling for AI data centers: AFL and Alcyon collaborate

September 23, 2026

MACOM ships 3.2T optical chipset for 8×448 Gbps PAM-4 links

September 23, 2026

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Engineering Deep Dives

Surendhar Somasundaram, principal engineer at Infineon

Vertical power delivery: Infineon’s VRM density roadmap and what it does to your thermals

Giuseppe Bernacchia, distinguished engineer at Infineon

Infineon on protecting the 800 V rack: fast enough to save it, slow enough not to trip it

Dr. Fanny Björk, Infineon — Microseconds, not milliseconds

Grid to core: the case for shifting to DC-grids

Latest Data Center Engineering News

OmniOn ships QODN Osprey 48V-to-12V bus converters up to 2.6 kW

October 9, 2026

7 benefits of ultrasonic welding for data center wire-to-terminal and busbar applications

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LiquidJet Diamond coldplate claims 35% more AI tokens per watt

October 9, 2026

Kioxia samples E1.L QLC SSDs for 1U hyperscale servers up to 30.72 TB

October 9, 2026

PCIe 7 signal conditioning portfolio spans copper and optical links for AI racks

October 9, 2026

Midea debuts power-cooling hyperconverged architecture for AI data centers

October 8, 2026

VDURA Data Platform V12 GA adds multi-tenant, API-driven GPU storage on Supermicro

October 8, 2026

Surendhar Somasundaram, principal engineer at Infineon

Vertical power delivery: Infineon’s VRM density roadmap and what it does to your thermals

October 7, 2026