Chroma — leaderboard

1.6Tbps DR8 LPO OSFP transceiver uses PIC with integrated lasers and OSPic processor

Centera Photonics has introduced a 1.6 Tbps DR8 LPO transceiver module in an OSFP form factor, built around NewPhotonics’ NewPhotonics NPG10203 1.6T LPO+ PIC with integrated lasers, modulators, and an OSPic optical signal processor.

The Centera 1.6 Tbps DR8 LPO OSFP transceiver integrates a laser-enabled photonic integrated circuit (PIC) and is designed around an ultra-low-power architecture aimed at scale-out data center interconnect, including hyperscaler and AI-driven deployments. The module uses NewPhotonics’ LPO+ PIC, which combines the lasers and modulators with OSPic optical signal processing in the same PIC.

LPO (linear pluggable optics) is being pursued in high-bandwidth scale-out networks because it targets lower power by shifting away from full DSP-based implementations. But interoperability and real-world link behavior still matter at 1.6T class speeds, especially as bandwidth density rises in leaf-spine fabrics. A 1.6 Tbps DR8 OSFP option is squarely aimed at those power and bandwidth tradeoffs operators are now forced to make in AI clusters.

“As AI workloads accelerate the demand for higher bandwidth and power efficient optical connectivity, our LPO pluggable will benchmark significant power savings and enable 1.6 Tbps hyperscaler expansion,” said Dr. KF Tsai, President of Centera Photonics.

NewPhotonics says its OSPic processes RF impairments in the optical domain as part of a “laser-integrated, compact solution,” and that the PIC is “application-optimized” for LPO+ modules. “Centera is accelerating the LPO transition from promise to production reality with our highly integrated, application-optimized LPO+ PIC that processes RF impairments in the optical domain in a laser-integrated, compact solution,” said Doron Tal, SVP & GM of Optical Connectivity at NewPhotonics.

More information is available from Centera Photonics and NewPhotonics.

Source: Centera Photonics

Yokogawa — below-posts ()

Get Data Center Engineering News In Your Inbox:

By subscribing, you agree to our Privacy Policy and Terms of Use. You can unsubscribe at any time.

Sponsored: Infineon at OCP 2026: Exclusive Content Hub. Executive interviews, technical documents, reference designs, and live expert panel. Unlock the hub.
Chroma — tower

Popular Posts:

Engineering AI Rack Power: Infineon Answers the Questions Asked at OCP, live expert panel with Carl Smith, Davide Chiola and Michael Williams
AI data center architecture evolution and key findings from OCP
thumb-dc1-selection-guide
Data center semiconductor selection guide
algm-data-center-news-release-image-202610
Allegro adds 800V data center current sensors and 48V cooling fan driver
aggreko-tier-4f-canada
Aggreko launches Tier 4 Final generators for Canada, including 600V 1200 kW model
Engineering AI Rack Power: Infineon Answers the Questions Asked at OCP, live expert panel with Carl Smith, Davide Chiola and Michael Williams
Engineering AI Rack Power: the Infineon expert panel, on demand

Share Your Data Center Engineering News

Do you have a new product announcement, webinar, whitepaper, or article topic? 

TDK — tower ()

Get Data Center Engineering News In Your Inbox:

By subscribing, you agree to our Privacy Policy and Terms of Use. You can unsubscribe at any time.

Yokogawa — leaderboard ()