ADLINK Technology has announced Express-PTL, its first COM Express computer-on-module family based on Intel Core Ultra Series 3 processors. ADLINK says the modules target complex edge AI workloads and general embedded systems by combining CPU, neural processing unit (NPU), and graphics processing unit (GPU) acceleration on a COM Express form factor, with additional industrial-temperature SKUs for rugged deployments.
ADLINK reports up to 180 total platform tera-operations per second (TOPS), split across an integrated NPU 5.0 at up to 50 TOPS and an integrated Intel Arc GPU at up to 120 TOPS. The Intel Arc GPU includes up to 12 Xe cores, and the platform supports up to 16 CPU cores. ADLINK also cites a hybrid CPU configuration of four performance cores, eight efficiency cores, and four low-power efficiency cores.
For memory and I/O-related features, ADLINK says Express-PTL supports up to 128 GB DDR5 SO-DIMM, including In-Band ECC (IBECC). The company also lists Time-Sensitive Networking (TSN) Ethernet, Thermal Control Circuit (TCC), extended temperature support, and FuSa and FSEDP compliance as industrial features intended to support mission-critical operation. ADLINK states industrial-temperature SKUs are rated for a –40 C to 85 C range.
In application terms, ADLINK positions the module for graphics-intensive embedded designs such as medical imaging and infotainment, and for autonomous robots including humanoids and quadrupeds that need navigation, object recognition, and real-time decision-making. ADLINK also calls out industrial automation, outdoor systems, and edge deployments exposed to severe temperature swings, and notes a higher-bandwidth PCIe interface intended to enable low-latency interaction with accelerators.
ADLINK also outlined additional Intel Core Ultra Series 3-based products on its roadmap: COM-HPC-mPTL, SBC35-PTL, and MXE-330. ADLINK says COM-HPC-mPTL integrates CPU, NPU, and GPU into a single unit with soldered-down memory for operation under vibration, shock, and extreme temperatures, and it is scheduled for Q2 2026 in a 95 mm x 70 mm module size. ADLINK says SBC35-PTL (a 3.5-inch single board computer) and MXE-330 will use an Adaptive Function Module (AFM) design for customizable I/O; both are planned for Q3 2026. ADLINK adds that Express-PTL and COM-HPC-mPTL development kits with reference carriers and full I/O support are expected in Q2 2026.
Source: ADLINK Technology
