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Tag: Intel

ADLINK ships Express-PTL COM Express modules with Intel Core Ultra Series 3 for edge AI

February 9, 2026

Karman launches 10 MW Heat Processing Unit for giga-scale AI data center cooling

January 27, 2026

Infortrend launches EonStor GS 5024U U.2 NVMe storage for AI and HPC workloads

January 21, 2026

Supermicro adds liquid-cooling and rack-scale manufacturing support for NVIDIA Vera Rubin and Rubin AI platforms

January 13, 2026

M5ERS joins Arm Flexible Access to develop ultra-low-power APU silicon for edge AI and data center workloads

January 9, 2026

Supermicro announces 6U SuperBlade with Intel Xeon 6900 CPUs for high-density data center compute

January 8, 2026

SK hynix 256GB DDR5 RDIMM validated for Intel Xeon 6 data center servers

December 24, 2025

ASUS launches scalable data center storage and server solutions for AI, HPC and enterprise workloads

December 10, 2025

Cornelis CN6000 SuperNIC enables 800 Gbps multi-protocol data center networking

December 9, 2025

AEWIN launches BIS-5132 2U data center servers with Intel Xeon 6 processors and scalable PCIe Gen5 expansion

December 4, 2025
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Johnson Controls previews YORK YK-HT centrifugal chiller for data center water-free heat rejection

February 17, 2026

Garrett Motion details oil-free centrifugal compressor roadmap for data center cooling and commercial HVAC

February 17, 2026

Avalanche and NOVI integrate 8 Gb MRAM for space-grade edge computing on satellite on-board computers

February 16, 2026

DG Matrix and Exowatt plan behind-the-meter power systems for hyperscale data centers

February 16, 2026

Johnson Controls has announced the YORK YDAM air-cooled chiller for high-density, multistory data centers

February 16, 2026

AIP Corp launches 8 GW behind-the-meter power microgrid platform for AI data center campuses in West Virginia

February 13, 2026

AmberSemi tapes out 1,000A PowerTile vertical power delivery for AI data center servers

February 13, 2026

Lightmatter and GUC team up on co-packaged optics for hyperscale data center AI interconnect

February 13, 2026
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