Empower Semiconductor has announced three new embedded silicon capacitors designed to improve power integrity for next-generation artificial intelligence (AI) and high-performance computing (HPC) processors. The new embedded capacitor (ECAP) lineup includes EC2005P, EC2025P, and EC2006P, targeting package-level integration to support extreme current densities and ultrafast transient response where board-level capacitors are no longer sufficient, according to the company.
The new devices scale capacitance in small form factors: the EC2005P provides 9.34 μF in a 2 mm x 2 mm package, the EC2025P provides 18.68 μF in a 4 mm x 2 mm package, and the EC2006P provides 36.8 μF in a 4 mm x 4 mm form factor. Empower positions the parts for embedding into the processor substrate to meet power delivery constraints as AI processors increase performance.
Empower says the ECAP devices are designed for power delivery network (PDN) performance, citing ultralow equivalent series inductance (ESL) and equivalent series resistance (ESR). The company adds that the parts are engineered to meet dimensional and tolerance requirements for embedded deployment within AI and HPC processors, and that their “wide bandwidth ultralow impedance” is intended to improve overall power integrity.
“Our customers are under intense pressure to deliver greater performance with tighter power margins,” said Steve Hertog, Senior Vice President Worldwide Sales, Empower Semiconductor. “These new ECAPs are a proven and practical way to deploy higher capacitance density into a smaller footprint right at the package level of the AI processor.”
Empower also says it will share more detail on PDN optimization strategies using ECAPs and its Crescendo vertical power delivery platform at Chiplet Summit (Feb. 17-19, 2026, Santa Clara Convention Center) and DesignCon (Feb. 24-26, 2026, Santa Clara Convention Center). The company reports the EC2005P, EC2025P, and EC2006P are now in mass production.
Source: Empower Semiconductor
