Amber Semiconductor (AmberSemi) has announced the successful silicon tape-out of its PowerTile vertical power-delivery solution for AI processors in data centers. AmberSemi says PowerTile is designed to mount on the backside of a server board directly beneath the processor, aiming to shorten the power path versus lateral distribution and reduce power-distribution losses.
AmberSemi describes PowerTile as an ultra-low-profile, 1,000 Amp vertical power device. The company claims the vertical delivery path reduces power distribution losses to the processor by more than 85%, improving efficiency and scalability for AI systems.
PowerTile is positioned as a scalable power-delivery building block for high-performance processors, including CPUs, graphics processing units (GPUs), field-programmable gate arrays (FPGAs), and other processors that require large current delivery in minimal space. AmberSemi reports the device measures 20 mm x 24 mm x 1.68 mm and that a single PowerTile can deliver up to 1,000 Amps directly to the processor; multiple devices can be paralleled to scale beyond 10,000 Amps.
AmberSemi also announced it will chair an industry session at APEC 2026 (Applied Power Electronics Expo) in March titled “Vertical Power for AI Data Centers.” AmberSemi says the session includes speakers from AMD, Nvidia, and Global Foundries, and will cover power-delivery architectures and trends for AI infrastructure.
AmberSemi says the PowerTile platform is being developed in close collaboration with chipmakers and data center ecosystem partners, aligned with next-generation processor roadmaps. The company expects to begin evaluation and testing with key partners later in 2026, with initial products shipping in material production volumes in 2027.
Source: AmberSemi
