Engineering AI Rack Power: Infineon Answers the Questions Asked at OCP, live expert panel with Carl Smith, Davide Chiola and Michael Williams
Expert panel recording · Video · 57 min
Locked

Engineering AI Rack Power: the Infineon expert panel, on demand

Expert panel recording · Video · 57 min
Locked

Engineering AI Rack Power: the Infineon expert panel, on demand

On October 29, 2026, three Infineon technology leaders took the questions engineers raised at OCP 2026, plus the ones that registrants for this panel sent in during the weeks before it. More than 600 engineers registered and submitted over 60 questions, from the voltage range to expect on an 800 V DC bus, including transients, to how DC-to-rack designs will meet grid ride-through rules, to which package architectures suit power components at 800 V. The full 57-minute recording is above.

The panel was moderated by Chris Ruoff, publisher of The Data Center Engineer, and recorded live on Zoom.

What the panel covered

  • 800 V DC distribution: what changes at the rack, the sidecar and the facility
  • Solid-state transformers and breakers: where they fit and what is still unsolved
  • Sidecar power racks and the move past 1 MW per rack
  • What to design for in 2027

On the panel

Carl Smith, Senior Director, We Power AI, Infineon Technologies. Smith leads the global We Power AI initiative, which brings Infineon’s data center power portfolio together from the grid connection to the processor.

Davide Chiola, Vice President, System Solutions, Infineon Technologies. Chiola leads the data center application power team and the system-level work behind Infineon’s AI rack power reference designs.

Michael Williams, Product and Application Marketing, Industrial and Infrastructure, Infineon Americas. Williams joined Infineon in 2018 and is responsible for product and application marketing for industrial and infrastructure power in the Americas.

Go deeper

The three Infineon documents the panel drew on, the executive interviews, and the panel itself are all part of the Infineon at OCP 2026 Hub. One registration unlocks everything.

The full interview continues after registration

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Executive interviews, technical documents and reference designs from Infineon on powering the AI data center, plus the recording of the expert panel held after OCP Global Summit. Register once to unlock everything, including the recording.

Data center selection guide41 pages
The future of powering AI24 pages
SST whitepaper5 pages
Expert panel recordingWatch on demand

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This resource hub is sponsored by Infineon Technologies. Documents are provided by Infineon; interviews are produced by The Data Center Engineer.

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