Live expert panel · Thursday, October 29, 2026 · 12:00 PM ET (9:00 AM PT)

Three Infineon technology leaders take the questions engineers raised at OCP 2026 and the ones you submit at registration: 800 V DC distribution, solid-state transformers and breakers, sidecar power racks, and what to design for in 2027. Live and moderated, 60 minutes.

The panel looks back at the key innovations and technical insights from OCP Global Summit in San Jose, with a particular focus on the evolving power architectures behind next-generation AI data centers. Through the lens of Infineon’s latest technologies and system-level work, the panelists will discuss the industry’s transition toward HVDC distribution, DC microgrids and more efficient energy delivery from grid to core.

The discussion connects the major themes and lessons from OCP with the challenges hyperscalers and infrastructure providers face today, and looks at how semiconductor innovation is shaping the future of AI infrastructure.

What we’ll cover

• Impressions and lessons from OCP Global Summit
• AI data center architecture evolution: from grid to rack to processor
• Power delivery trends, including HVDC and next-generation power conversion
• Key engineering challenges: power density, cooling, efficiency and scalability
• The outlook for AI factories and hyperscale infrastructure
• Live audience Q&A with the panelists

Meet the panelists

Carl Smith

Senior Director, We Power AI, Infineon Technologies

Carl Smith is a Senior Director at Infineon Technologies, where he leads the global go-to-market activity for the We Power AI application, covering AI data centers from grid to core in the C3 segment (Consumer, Computing & Communications). Carl re-joined International Rectifier in 2010 and became part of Infineon Technologies after its acquisition in 2015. Before that he held global product marketing and business development roles at Vicor Corporation and, in an earlier tenure with International Rectifier, focused on power management solutions in the consumer, enterprise computing, telecom and communications segments. Carl holds a BEng (Hons) in Electrical & Electronic Engineering from Loughborough University in the UK.

Davide Chiola

Vice President, System Solutions, Infineon Technologies

Davide Chiola is Vice President of System Solutions at Infineon Technologies, leading the data center application power team. With nearly 30 years of experience in power semiconductors and power electronics, he drives technical strategy, product definition, system architecture and application engineering across silicon, SiC and GaN technologies. Since joining International Rectifier in 1996 and later becoming part of Infineon, Davide has held leadership roles spanning technology development, application engineering and technical marketing, supporting innovation across industrial, consumer, automotive and energy applications.

Michael Williams

Product and Application Marketing, Industrial and Infrastructure, Infineon Americas

Michael Williams joined Infineon in May 2018. He is responsible for product and application marketing in the Industrial and Infrastructure segment for Infineon Americas, overseeing grid and data center infrastructure, renewables, solid-state transformers, solid-state circuit breakers and Infineon’s broad portfolio for industrial applications. As an Infineon champion for silicon carbide technology, Michael draws on his knowledge of Infineon’s products, a deep understanding of power electronics and years of market experience to support the market’s electrification journey.

Register to Reserve Your Seat and Unlock Infineon’s Exclusive Content Hub

Executive interviews, technical documents and reference designs from Infineon on powering the AI data center, plus a live expert panel after OCP Global Summit. Register once to unlock everything and reserve your seat for the panel.

Data center selection guide41 pages

The future of powering AI24 pages

SST whitepaper5 pages

Expert panel seatThu, Oct 29, 2026

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