Flex has announced a partnership with LG Electronics to jointly develop integrated and modular cooling solutions specifically designed for high-density data centers supporting artificial intelligence (AI) workloads. The companies state this collaboration aims to address increasing power and thermal management challenges in next-generation compute environments by combining Flex’s liquid cooling, power products, and IT infrastructure with LG’s high-performance air and liquid cooling portfolio.
According to Flex, the combined suite includes liquid cooling systems, proprietary power products, IT infrastructure, and LG’s modules for air and liquid cooling, such as computer room air conditioners (CRAC), computer room air handlers (CRAH), chillers, coolant distribution units (CDUs), and a range of monitoring and thermal management solutions. This joint offering will allow data center operators to tailor cooling architectures based on specific deployment requirements, scaling with demand as data center loads and densities increase.
Flex reports that the new prefabricated, modular solutions will be available as part of the Flex AI infrastructure platform—its platform integrating power, cooling, compute, and services in modular configurations. LG’s advanced chiller systems work with both Flex and LG CDUs and secondary fluid networks, which the companies claim maintain separation between facility and IT cooling fluids to help safeguard compute assets and enhance operational reliability. Flex further claims these integrated technologies enable reliable temperature control, optimize energy consumption, and support rapid, scalable deployment of high-density AI workloads.
“Through our collaboration with LG, Flex now offers customers a complete range of cooling solutions to tackle escalating heat challenges in the data center,” said Michael Hartung, President and Chief Commercial Officer, Flex. “Together, we’ll deliver prefabricated, scalable data center infrastructure solutions that incorporate advanced liquid and air cooling technologies to increase efficiency, simplify deployment, and speed time to revenue for our customers.”
LG presented its latest cooling technologies at Data Center World in Washington DC and at Data Center World Asia 2025 in Singapore, detailing its strategy to expand its presence in the global data center market. The partnership targets advanced data center operators, especially those requiring robust cooling for AI applications, and is also relevant for broader sectors using high-density compute and thermal management solutions.
Source: Flex
