Supermicro has announced the expansion of its NVIDIA Blackwell system portfolio with two new front input/output (I/O) systems designed for high-density artificial intelligence (AI) and cloud-scale data center deployments. The new models include a 4U DLC-2 liquid-cooled system, which Supermicro claims provides up to 40 percent data center power savings, and an 8U air-cooled system optimized for cold aisle serviceability and flexible memory configurations.
Both the 4U liquid-cooled and 8U air-cooled front I/O systems feature support for eight NVIDIA ConnectX-7 400G network interface cards (NICs) and two NVIDIA Bluefield-3 data processing units (DPUs), all relocated to the front of the chassis for easier cabling and cold aisle access. These systems support NVIDIA Quantum-2 InfiniBand and Spectrum-X Ethernet for high-bandwidth compute fabrics. The new platforms also offer 32 dual in-line memory module (DIMM) slots, enabling up to 8 TB capacity at 5200 MT/s or up to 4 TB at 6400 MT/s with DDR5 RDIMM, and can operate with dual-socket Intel Xeon 6700 Series processors with a thermal design power up to 350 W.
The 8U air-cooled model is engineered for environments without liquid cooling infrastructure. It maintains a compact footprint by incorporating a reduced-height CPU tray, while retaining a full-height 6U GPU tray to maximize airflow and thermal performance. Both systems are compatible with NVIDIA HGX B200 eight-GPU configurations, offering 1.4 TB total HBM3e GPU memory per appliance and GPU interconnects via fifth-generation NVLink at 1.8 TB per second.
According to Supermicro, the front I/O systems allow for easier deployment, improved cabling, and lower operational expenses in large-scale AI training clusters or inference environments, and will support future NVIDIA HGX B300 platforms. These systems are intended for hyperscale data centers, colocation providers, and technology vendors building dense, scalable AI factories.
“Supermicro’s DLC-2 enabled NVIDIA HGX B200 system leads our portfolio to achieve greater power savings and faster time to online for AI Factory deployments,” said Charles Liang, CEO and president, Supermicro. “Our Building Block architecture enables us to quickly deliver solutions exactly as our customers request. Supermicro’s extensive portfolio now can offer precisely optimized NVIDIA Blackwell solutions to a diverse range of AI infrastructure environments, whether deploying into an air- or liquid-cooled facility.”
“Based on the latest NVIDIA Blackwell architecture, Supermicro’s new front I/O B200 systems equip enterprises to deploy and scale AI at unprecedented speed—delivering breakthrough innovation, efficiency, and operational excellence,” said Kaustubh Sanghani, vice president of GPU product management at NVIDIA.
Source: Supermicro
