Rosenberg introduces high-efficiency 575 Volt EC fan module optimized for data center cooling

Rosenberg USA has introduced a new high-performance EC fan module, the Model N88-50709, featuring a robust 575 Volt, 7.4 kW electronically commutated (EC) motor paired with its I-Series backward-curved impeller, winner of a 2025 AHR Innovation Award. Designed for high-volume airflow applications, this unit delivers airflow up to 8,000 CFM at 5 inWG static pressure with a noise output of only 88 dB(A). At free air (no back pressure), the module achieves a maximum airflow of approximately 12,000 CFM.

The N88-50709 incorporates Rosenberg’s Gen 3+ EC motor technology, which maintains consistently high efficiency across a range of operating speeds and conditions, including partial-load scenarios. The motor accepts input voltages from 460 to 600V AC, and fan speed is infinitely adjustable, allowing precise airflow control.

The award-winning I-Series impeller design integrates five aluminum backward-curved, hollow-profile airfoil section blades and an efficiency-enhancing circumferential diffuser. According to Rosenberg USA, compared to previous generation impellers, the new design boosts efficiency by up to 11% and reduces noise by more than half, depending on fan size and operating point.

With low installation depth and maintenance-free operation due to a cool-running EC motor and permanently lubricated ball bearings, the Model N88-50709 is engineered for simple integration into data center cooling systems, as well as industrial HVAC and commercial refrigeration equipment.

Rosenberg fans are also utilized throughout critical infrastructure, including air cooling aids for variable frequency drives, wind power generators, power converters, solar inverters, uninterruptible power supplies, telecom racks, and in applications spanning railway, marine, military, and avionics environments.

Source: Rosenberg USA

Get Data Center Engineering News In Your Inbox:

Popular Posts:

logo_on-white
Vultr introduces AMD Instinct MI355X GPUs to enhance AI workload performance and efficiency in data centers
Keysight EDA and Intel Foundry
Keysight and Intel Foundry announce collaboration on EMIB-T packaging technology for data center chiplet designs
pr-image-forcadence-and-samsung-foundry-expand-collaboration-to-accelerate-ai-data-center-chip-design-and-power-optimization-jpg
Cadence and Samsung Foundry expand collaboration to accelerate AI data center chip design and power optimization
GmyybkpD3o7f45xka2pctu42nog
FS launches high-density 1U WDM platform for data centers, maximizing rack space and passive cooling
Grid8-graph
Grid8 launches free interconnection dashboard for US data center and energy operators

Share Your Data Center Engineering News

Do you have a new product announcement, webinar, whitepaper, or article topic? 

Get Data Center Engineering News In Your Inbox: