Molex has launched its Impress Co-Packaged Copper Solutions, a compression-based, on-substrate connector and mating cable assembly designed to improve signal integrity and power distribution for next-generation data centers and AI workflows. Molex says Impress supports data rates up to 224 Gbps PAM-4 and beyond, targeting near-ASIC connectivity where reducing channel loss and crosstalk is critical at higher speeds.
Impress builds on Molex NearStack On-the-Substrate (OTS) Connectors, which Molex describes as a direct-to-chip approach that moved high-speed paths off the board; Molex reports it has delivered more than one million NearStack units to date. Molex positions Impress as the next architectural step by placing the connection point directly onto the ASIC package substrate to shrink how far signals must travel through the Printed Circuit Board (PCB). Molex says the result is a two-piece connector system delivering a “full-channel solution” with “complete isolation from the substrate to the interconnect,” reducing signal loss and crosstalk.
“As AI workloads push data centers to their physical limits, we are focused on maximizing efficiency without sacrificing signal integrity,” said Jairo Guerrero, VP and GM, Copper Solutions, Molex. “Impress is our latest innovation built to help scale infrastructures without exponential increases in power consumption or cost.”
For operations and serviceability, Molex says the Impress socket is compression-attached to the substrate to help prevent damage to the substrate and simplify rework, maintenance, and upgrades. Molex also highlights over-molded cable strain relief and a mechanical contact wipe feature intended to support long-term mating durability and operational lifecycles, along with a compact form factor aimed at scalable density and efficient power distribution.
Molex says Impress is available now for applications requiring data rates up to 224 Gbps PAM-4, with development work underway to validate the platform for 336G and 448G applications. Molex also positions Impress within its broader 224G portfolio, naming Mirror Mezz Enhanced, Inception, and CX2 Dual Speed.
Source: Molex
