IEEE’s premier electronic components and technology conference — 800+ papers on advanced packaging, thermal management, and interconnect technologies. This is where chiplet architectures, 3D IC packaging, and next-gen thermal interface materials get their first public technical reviews.

The packaging decisions made here define the TDP envelopes and cooling requirements that data center engineers deal with downstream. If you want to understand why future server thermals look the way they do, ECTC is where those constraints originate.

Produced by: IEEE Electronics Packaging Society
Format: Technical conference with peer-reviewed papers
Focus: Advanced packaging, 2.5D/3D integration, chiplets, co-packaged optics, thermal management for HPC/AI
Audience: Packaging engineers, semiconductor researchers, materials scientists