Amber Semiconductor (AmberSemi) has announced the successful silicon tape-out of its PowerTile vertical power delivery solution, which it says is designed for AI processors in data centers. AmberSemi positions the milestone as progress toward a higher-efficiency power-delivery architecture as AI processor current demands increase.
According to AmberSemi, PowerTile is an ultra-low-profile 1,000 A vertical power device that mounts on the backside of a server board directly beneath the processor. The company says delivering power through a vertical path rather than traditional lateral distribution reduces power distribution losses to the processor by more than 85%.
AmberSemi describes PowerTile as a scalable platform intended to support CPUs, graphics processing units (GPUs), field-programmable gate arrays (FPGAs), and other high-performance processors that require high current in minimal space. The device measures 20 mm x 24 mm x 1.68 mm, and AmberSemi says a single device can deliver up to 1,000 A directly to the processor; multiple devices can be paralleled to scale beyond 10,000 A.
AmberSemi also announced it will chair an industry session at Applied Power Electronics Expo (APEC) 2026 in March titled “Vertical Power for AI Data Centers.” The session is slated to include speakers from AMD, Nvidia, and GlobalFoundries and will focus on power-delivery architectures and trends for AI infrastructure.
AmberSemi says the PowerTile platform is being developed in collaboration with chipmakers and data center ecosystem partners aligned with next-generation processor roadmaps. The company expects to begin evaluation and testing with key partners later in 2026, and it reports that initial products are expected to ship in material production volumes in 2027.
Source: AmberSemi
