Celestica has opened ordering for its DS6000-series 1.6 TbE Ethernet switches, moving the platform to ready-to-order status for initial customers building high-bandwidth AI back-end networks.
The DS6000-series comes in two chassis variants aimed at different rack and cooling environments: the air-cooled 3RU Celestica DS6000 for standard 19-inch racks, and the hybrid-cooled 2OU DS6001 for 21-inch OCP ORv3 deployments. Both systems are built on Broadcom Tomahawk 6 (TH6) silicon and are specced at up to 102.4 Tbps of non-blocking switching capacity, with 64 ports of 1.6 TbE using OSFP224.
For data center engineers, the core story is port and bandwidth density. 64 ports of 1.6 TbE in a single switch pushes aggregation and spine designs into a new class of link budgets, cabling plans, and thermal constraints, especially when you’re scaling GPU clusters where east-west traffic can dominate. The split between a 19-inch, air-cooled chassis and a 21-inch ORv3 option also signals that vendors expect 1.6 TbE to land in both conventional enterprise footprints and OCP-style AI rows.
On the networking stack side, Celestica highlighted open networking via SONiC, and said the DS6000-series targets “scale-up and scale-out networking” using industry specifications including Ultra Ethernet Consortium (UEC) and Open Compute Project (OCP) Ethernet Scale-up Network (ESUN). The switches support both high-speed copper interconnects and 1.6 TbE optical interconnects.
“By integrating enterprise-class reliability with the flexibility of open networking through SONiC, we have engineered a solution that not only meets current throughput demands but helps future-proof the AI fabric for our global customers,” said Gavin Cato, SVP and GM, AI Platform Engineering at Celestica.
Broadcom’s Hasan Siraj, vice president of product management, Core Switching Group, said Celestica is “among the first to ship systems powered by our Tomahawk 6 silicon.” Celestica said the DS6000-series is now available for order.
Source: Celestica
