Chroma — leaderboard

Infinium launches Infinium Edge platform for high-density AI data center immersion cooling

Infinium has announced Infinium Edge, a data center infrastructure platform aimed at enabling high-density artificial intelligence (AI) and high-performance computing (HPC) workloads using immersion cooling. The company positions cooling as a key constraint as graphics processing unit (GPU) and central processing unit (CPU) power densities rise, impacting data center performance, efficiency, siting, and scale.

A core element of the platform is Infinium Edge Immersion Fluids, which Infinium describes as a new class of custom-engineered dielectric immersion fluids designed for AI and HPC data centers. Infinium says the fluids remove heat directly at the source of computation to support sustained, high-efficiency thermal performance, with the goal of enabling higher-density deployment of next-generation AI hardware while improving reliability and reducing infrastructure complexity.

Infinium frames immersion cooling against other cooling approaches by citing typical rack power-density ranges. It reports conventional air-cooled data centers typically support about 10–20 kW per rack, while direct-to-chip liquid cooling systems can reach 40–80 kW per rack, often with increased mechanical complexity and reliance on chilled-water infrastructure. Infinium says immersion cooling—submerging IT equipment in a dielectric fluid—supports substantially higher power densities, making immersion fluids increasingly important for next-generation AI data center design.

Infinium also differentiates its fluids from “commodity dielectric liquids,” stating its fluids are “cleaner, synthetic products” and do not contain “residual contaminants found in petroleum-derived immersion fluids” that it says may limit reliability and long-term performance in immersion-cooled systems. Infinium adds that Edge Immersion Fluids are designed to operate continuously while maintaining predictable performance under sustained high-temperature thermal loads common in AI and HPC environments.

“Cooling has become one of the defining constraints on deploying state-of-the-art AI compute systems,” said Robert Schuetzle, CEO of Infinium. “Infinium Edge leverages our expertise in advanced chemistry and industrial-scale manufacturing to deliver an immersion cooling platform that advances next-generation AI infrastructure. This enables faster computing and more sustainable operations, while at the same time reducing the power and water consumption of conventional data center cooling technologies.”

Source: Infinium

Yokogawa — below-posts ()

Get Data Center Engineering News In Your Inbox:

By subscribing, you agree to our Privacy Policy and Terms of Use. You can unsubscribe at any time.

Sponsored: Infineon at OCP 2026: Exclusive Content Hub. Executive interviews, technical documents, reference designs, and live expert panel. Unlock the hub.
Chroma — tower

Popular Posts:

Engineering AI Rack Power: Infineon Answers the Questions Asked at OCP, live expert panel with Carl Smith, Davide Chiola and Michael Williams
AI data center architecture evolution and key findings from OCP
thumb-dc1-selection-guide
Data center semiconductor selection guide
thumb-sst1-solid-state-transformers
Why line-frequency transformers fall short in AI data center power design
thumb-dc2-future-of-powering-ai
Redefining the power flow in and beyond AI data centers
Dr. Fanny Björk, Infineon — Microseconds, not milliseconds
Grid to core: the case for shifting to DC-grids

Share Your Data Center Engineering News

Do you have a new product announcement, webinar, whitepaper, or article topic? 

Yokogawa — tower ()

Get Data Center Engineering News In Your Inbox:

By subscribing, you agree to our Privacy Policy and Terms of Use. You can unsubscribe at any time.

Yokogawa — leaderboard ()