Keysight Technologies has announced a collaboration with Intel Foundry to support Embedded Multi-die Interconnect Bridge-T (EMIB-T), a high-performance semiconductor packaging technology tailored specifically for artificial intelligence (AI) and data center markets. EMIB-T is designed to enhance die-to-die (D2D) interconnectivity in complex chiplet and 3D Integrated Circuit (3DIC) packages, ensuring reliable communication, high-speed data transfer, and improved power efficiency for next-generation semiconductor solutions.
Keysight’s latest solution, Chiplet PHY Designer, now supports advanced simulations for the Universal Chiplet Interconnect Express (UCIe) 2.0 and Open Compute Project’s Bunch of Wires (BoW) standards. These emerging interconnect standards define communication protocols for 2.5D and 3D semiconductor packaging, enabling high-quality integration and greater interoperability among chiplets and varied packaging designs.
The integration of UCIe 2.0 and BoW standards into Keysight’s Chiplet PHY Designer, combined with support for Intel Foundry’s EMIB-T silicon bridge technology, addresses critical design challenges in the data center and AI chiplet design space. Engineers can perform pre-silicon validation, compliance checks, and link-margin analyses, streamlining chiplet integration and improving overall performance reliability prior to manufacturing.
“Our collaboration with Keysight EDA on EMIB-T silicon bridge technology is a pivotal step in advancing high-performance packaging solutions,” said Suk Lee, VP & GM of Ecosystem Technology Office, Intel Foundry. “By integrating standards like UCIe™ 2.0, we enhance chiplet design flexibility for AI and data center applications, accelerating innovation and ensuring our customers meet next-generation demands with precision.”
“Keysight EDA’s pioneering Chiplet PHY Designer continues to redefine pre-silicon validation, empowering chiplet designers with rapid, accurate verification,” said Niels Faché, Vice President and General Manager, Keysight’s Design Engineering Software. “By proactively embracing evolving standards like UCIe 2.0 and BoW, and now with critical support for Intel Foundry’s EMIB-T, we’re enabling engineers to accelerate innovation and eliminate costly design iterations before manufacturing.”
Keysight will demonstrate its EMIB-T workflow for system-level link performance and compliance, featuring Intel Foundry’s EMIB-T technology, at Intel Foundry Direct Connect on April 29 in San Jose.
Source: Keysight Technologies
