Rigaku launches ONYX 3200 for advanced semiconductor metal inspection

Rigaku has announced the launch of the ONYX 3200, a semiconductor metrology system designed for film thickness, composition, and bump structure measurements in wafer-level processes. The system targets quality stabilization and yield improvement in the metal wiring formation and packaging stages of semiconductor manufacturing, which are critical for data centers and advanced computing hardware.

According to Rigaku, the ONYX 3200 allows complete inspection of metal structures from chip wiring through advanced packaging on a single platform. This addresses the increased complexity of interconnects and bump features in devices for data centers and other high-performance sectors, where reliability and uniformity can directly affect end-user performance.

The ONYX 3200 integrates several technical features. Its 3D confocal scanner inspects the shapes and heights of microscopic bumps, often under 10 micrometers, and electroconductive metal patterns with high precision. It combines an optical scanner to capture total bump geometry with a fluorescent X-ray detector for upper metal layer thickness. By subtracting these values, Rigaku reports the system can calculate lower metal layer properties, enabling improved interconnect reliability assessment.

The ONYX 3200 features a proprietary dual-head microfocus X-ray source. This enables measurement of silver content as low as two percent within tin-and-silver (SnAg) bumps, with a precision of four parts per 100,000. The dual-head architecture supports simultaneous measurement of various metal features around chip interconnects to boost throughput and analytical flexibility.

Rigaku reports that it has already shipped the first ONYX 3200 to a global foundry for use in advanced packaging lines and is seeing strong interest among leading semiconductor manufacturers. The company aims for 1.5 billion yen in ONYX 3200 sales in fiscal year 2026, with plans to double that in the following year as adoption grows in packaging and back-end-of-line applications.

For further details, Rigaku has provided additional product specifications at its website.

Source: Rigaku

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