Rigaku Corporation has announced the launch of the XTRAIA MF-3400, a new tool designed to measure wafer thickness and composition during semiconductor manufacturing. According to Rigaku, the XTRAIA MF-3400 targets productivity demands in the growing market for data center and artificial intelligence (AI) hardware, where high-performance semiconductors are essential.
The XTRAIA MF-3400 employs enhanced X-ray analytical technologies developed by Rigaku. The new platform supports nondestructive, nanoscale-precision measurement on fields as small as 50 micrometers, achieving sub-nanometer thickness measurements. The system’s capability to double X-ray dose, combined with a new transport system, enables a significant increase in wafers processed per hour compared to previous models.
The instrument supports automated, recipe-driven analyses across three X-ray analytical modes: fluorescent X-rays, X-ray reflectance, and X-ray diffraction. This architecture supports various measurement objectives, such as determining ultra-thin-film thickness and crystalline structure. Notably, the XTRAIA MF-3400 also offers measurement of molybdenum, identified as a next-generation semiconductor material in the press release.
KIOXIA Corporation and KIOXIA Iwate Corporation have chosen the XTRAIA MF-3400 for mass-production lines for 3D NAND flash memory. Rigaku reports the tool is also expected to be used in the production of dynamic random-access memory and logic semiconductors, which are critical to AI and data center infrastructure.
Customization options allow manufacturers to select from a range of modules, enabling tailored measurement environments for specific semiconductor manufacturing processes. Rigaku projects combined sales for the new model and its predecessor to exceed JPY 6 billion in fiscal year 2026, and aims for annual growth above 20 percent for the model lines beginning fiscal year 2027.
More product information can be found on Rigaku’s website.
Source: Rigaku Corporation
