Sandisk has announced the signing of a Memorandum of Understanding with SK hynix to jointly establish and standardize the specification for High Bandwidth Flash, a memory technology targeting next-generation artificial intelligence (AI) inference workloads. The companies report that their collaboration will define technical requirements and explore the creation of a technology ecosystem for High Bandwidth Flash.
According to Sandisk, High Bandwidth Flash will be enabled by its advanced BiCS technology and proprietary CBA wafer bonding process, developed with input from leading AI industry players. Sandisk notes that its HBF technology was named “Best of Show, Most Innovative Technology” at the Future of Memory and Storage 2025 event. Initial samples of Sandisk’s High Bandwidth Flash memory are targeted for the second half of 2026, with first AI-inference devices using the technology expected in early 2027.
Sandisk also established a Technical Advisory Board to guide development and strategy for High Bandwidth Flash memory technology. This board will provide strategic guidance and technical insight as the company aims to establish a standards-driven ecosystem.
Regarding applications, Sandisk identifies large data centers, small enterprises, and edge deployments as target markets for High Bandwidth Flash in AI inference workloads.
Alper Ilkbahar, Executive Vice President and Chief Technology Officer at Sandisk, stated, “By collaborating with SK hynix to define the High Bandwidth Flash specification, we are addressing the critical need for scalable memory in the AI industry,” said Alper Ilkbahar, Executive Vice President and Chief Technology Officer, and HBF Technical Advisory Board member at Sandisk. “This collaboration accelerates innovation and will offer the industry new tools to handle the exponential data demands of tomorrow’s applications. Our work will help provide an effective solution to meet the world’s technology needs and exceeds expectations of our respective customers.”
Dr. Hyun Ahn, President and Chief Development Officer at SK hynix, added, “There is an ever-increasing need for solutions that address the challenges of next-generation computing,” said Dr. Hyun Ahn, President and Chief Development Officer at SK hynix. “Through our work with Sandisk to standardize the High Bandwidth Flash specification, we are actively contributing to the commercialization of this innovative technology, which we believe is key to unlocking the full potential of AI and next-generation data workloads.”
Source: Sandisk
