VEIR, a Massachusetts-based company specializing in superconducting power delivery, has successfully demonstrated its first-generation Superconducting Technology for AI Racks (STAR) by delivering 3 megawatts (MW) of power through a single low-voltage cable in a simulated data center environment near its Woburn headquarters. The company claims the STAR demonstration validates its cable technology for high-density, scalable power delivery for advanced data center architectures, particularly those supporting artificial intelligence (AI) workloads.
According to VEIR, the STAR system operates at up to 800 volts and is built around its patented superconducting cables featuring zero electrical resistance and a novel cooling platform. The result is power distribution capabilities that reach up to 10 times the throughput and cover more than five times the distance achievable with conventional copper systems, all while reducing cable routing footprints by more than 20 times. VEIR reports this enables the transfer of more power over longer distances with smaller and fewer cables, offering high compute density and reducing network latency in next-generation data center designs.
The demonstration highlighted several technical milestones: the ability to scale to deliver hundreds of MW within physical building constraints; the integration and performance of a low-voltage superconducting cable at scale; and resilience and safety across diverse data center scenarios. VEIR also notes reduced deployment time for commercial solutions due to the system’s modularity and in-house development process.
The company cites projections from the International Energy Agency that global data center electricity consumption could exceed 945 terawatt-hours per year by 2030, driven by rack-level requirements exceeding 500 kilowatts per rack for some AI applications. VEIR claims its technology addresses the growing limits of conventional busbar and copper cabling infrastructure.
“Using superconducting technology, we are able to move massive amounts of power to maximize performance – safely, reliably, and at scale,” said Erhan Karaca, VEIR CTO. Tim Heidel, CEO of VEIR, added, “This demonstration marks a major milestone for VEIR and the industry, proving that superconducting power technology can deliver the high-power levels needed in a data center environment, while dramatically reducing the space and weight demanded by traditional systems. Our technology is ready to deploy and provides an immediate solution needed to power the next generation of computing.” Data center industry advisor Peter Gross stated, “The successful demonstration of VEIR’s technology shows that a new path for high power density, high-reliability infrastructure is not only possible but ready to be integrated into today’s data center designs.”
VEIR has indicated it will announce its first customer deployments ahead of planned full commercialization in 2026. The company also works on solutions for broader power transmission challenges, but current efforts prioritize hyperscale and AI-driven data center requirements.
Source: VEIR
