Wolfspeed produces first 300mm silicon carbide wafer to boost data center power and cooling efficiency for AI servers

Wolfspeed has announced it has successfully produced a single-crystal 300 mm (12-inch) silicon carbide (SiC) wafer. Wolfspeed says the milestone is intended to establish a path to future volume commercialization of 300 mm SiC, with target applications including AI infrastructure, augmented reality and virtual reality (AR/VR), and advanced power devices.

The company says the work is backed by an intellectual property portfolio of more than 2,300 issued and pending patents worldwide and supported by a vertically integrated supply chain spanning crystal growth through advanced packaging. Wolfspeed frames the move to 300 mm as a manufacturing scalability and performance step for demanding semiconductor applications, including next-generation computing platforms and high-efficiency power devices.

“Producing a 300mm single crystal silicon carbide wafer is a significant technology achievement and the result of years of focused innovation in crystal growth, boule and wafer processing,” said Elif Balkas, CTO. “It positions Wolfspeed to support the industry’s most transformative technologies, especially critical elements of the AI ecosystem, immersive augmented and virtual reality systems, and other advanced power device applications.”

For data center and AI infrastructure, Wolfspeed says rising AI workloads are increasing demand for improved power density, thermal performance, and energy efficiency. The company says its 300 mm SiC technology is intended to enable wafer-scale integration of high-voltage power delivery systems, advanced thermal solutions, and active interconnects, extending performance beyond traditional transistor scaling.

Wolfspeed also says its 300 mm platform will unify high-volume SiC manufacturing for power electronics with high-purity semi-insulating substrates used in optical and radio-frequency (RF) systems, enabling wafer-scale integration across optical, photonic, thermal, and power domains. Beyond AI infrastructure and AR/VR, Wolfspeed says a larger wafer diameter can improve the ability to meet demand cost-effectively for applications including high-voltage grid transmission and next-generation industrial systems.

Source: Wolfspeed

Get Data Center Engineering News In Your Inbox:

Popular Posts:

1765906506220
Tritium launches 800 VDC bidirectional inverter for data centers and renewable energy sites
Screenshot
Five AI data centers to reach 1 GW power capacity in 2026, new analysis shows
Water_From_Air_Data_Center_Rendering_Nov_2025
iMasons selects Water From Air for data center waste heat-to-water innovation
68e79d30a17eea847251fae6_img-home-product-liquidjet-main
Frore Systems updates LiquidJet direct-to-chip coldplate for 1,950 W NVIDIA Rubin data center GPUs
River Bend Rendering
Hut 8 announces $7 billion, 245 MW hyperscale data center IT lease with Fluidstack backed by Google

Share Your Data Center Engineering News

Do you have a new product announcement, webinar, whitepaper, or article topic? 

Get Data Center Engineering News In Your Inbox: