SK hynix has announced that its 256GB DDR5 Registered Dual-Inline Memory Module (RDIMM), built using 32-gigabit (Gb) fifth-generation 10-nanometer (nm)-class (1b) DRAM, has completed compatibility testing and validation with the Intel Xeon 6 platform. This makes it the first server memory module in the industry to secure Intel Data Center Certification for deployment with Xeon 6 processors, according to SK hynix.
The 256GB DDR5 RDIMM underwent comprehensive validation in Intel’s Advanced Data Center Development Laboratory, verifying its performance, compatibility, and reliability in server environments. The module uses 32Gb DRAM chips, enabling a doubling of capacity compared to 128GB modules built on similar process nodes.
SK hynix reports that server systems outfitted with this new RDIMM can achieve up to 16 percent higher inference performance versus systems using 32Gb die-based 128GB modules. Additionally, the company claims the new module delivers up to 18 percent lower power consumption compared to previous 256GB offerings based on 16Gb 1a DRAM, improving data center energy efficiency and performance per watt.
The target market for this product includes hyperscale data center operators and enterprise server customers handling AI workloads and large, real-time data sets. SK hynix notes this high-capacity module is designed to support the expanding memory requirements driven by advanced AI inference models and modern server infrastructure.
Sangkwon Lee, head of DRAM Product Planning & Enablement at SK hynix, stated, “We are now able to respond more swiftly to customer needs, solidifying our leadership in the server DDR5 DRAM market. As a full-stack AI memory creator, we will actively address the growing demand for high-performance, low-power, and high-capacity memory solutions to further enhance customer satisfaction.”
Dr. Dimitrios Ziakas, VP of Platform Architecture, Intel Data Center Group, added, “This achievement represents the culmination of collaborative engineering efforts across Intel and SK hynix and demonstrates our shared commitment to advancing memory technology. The high-capacity module addresses the increasingly demanding requirements of capacity-hungry workloads of AI applications, enabling our customers to unlock new levels of performance and efficiency in their data center operations.”
Source: SK hynix
