NovoLINC has announced the closing of an oversubscribed funding round, co-led by Fathom Fund and TDK Ventures, with participation from Foothill Ventures, M Ventures, Carnegie Mellon University, and new investor Hitachi Ventures. NovoLINC reports that the capital will accelerate manufacturing, research and development, and business development to meet growing demand for its proprietary nanostructured thermal interface materials (TIM) designed for high-performance computing and liquid-cooled data centers.
According to NovoLINC, its TIM technology targets the increasing thermal management demands from the transition to liquid cooling in multi-kilowatt graphics processing units (GPUs), central processing units (CPUs), and application-specific integrated circuit (ASIC) accelerators. NovoLINC claims its material achieves thermal resistance of 0.7 mm²•K/W, over 10 times lower interface resistance than conventional TIMs. The nanostructured design is engineered to manage hot spots and maintain contact across chip warpage, aiming to address semiconductor packaging reliability at power densities exceeding 100 W/cm².
The company notes that its continuous manufacturing process supports scalable and cost-effective deployment across global computing infrastructure. NovoLINC estimates its solution can provide more than 30 percent improvement in chip-to-coolant thermal efficiency for direct liquid cooling, and claims that widespread adoption could reduce annual data center energy consumption by over 30 terawatt-hours by 2030.
NovoLINC reports commercial engagement with major ecosystem players including hyperscale operators, advanced AI and networking chip providers, server original equipment manufacturers, and cold plate manufacturers. The company has received recognition from industry programs such as the Open Compute Project Startup Member Program and the NVIDIA Inception Program.
Dr. Ning Li, Co-founder and CEO of NovoLINC, stated, “Our team is collaborating closely with industrial partners to accelerate the manufacturing scaleup and the commercialization of our technology to meet the surging needs of high-power computing and sustainable AI data center operations. This investment validates our critical role in enabling the next generation of AI and high-performance computing.”
Paul Sheng, Managing Partner at Fathom Fund, said, “As power density rises with each generation of GPUs, thermal dissipation will become a critical roadblock in AI infrastructure. The novel material system developed by NovoLINC not only allows superior Z-direction thermal dissipation compared to current state-of-the-art but also does this with continuous production scalability and cost efficiency through industry-tested electrochemistry. It’s the critical building block in liquid cooling.”
Tina Tosukhowong, Investment Director at TDK Ventures, commented, “As 40% of a data center’s energy consumption goes toward cooling, NovoLINC is tackling one of the most pressing technical challenges in the industry. By offering the lowest thermal resistance and the necessary performance and scalability, their thermal interface technology is the essential solution to make chip cooling more efficient and support the industry-wide shift to liquid cooling for next-generation computing chips.”
Source: NovoLINC
