Airedale by Modine, a Modine brand, has highlighted its portfolio of data center cooling technologies, emphasizing air-cooled chillers with concurrent free cooling as it targets higher-temperature, higher heat-density thermal architectures. The company says the shift is being driven by next-generation chips and the need to remove heat from both the data center hall and water flowing through server racks, with the goal of improving energy efficiency and minimizing Power Usage Effectiveness (PUE).
Airedale says it has more than two decades of experience with concurrent free cooling, a design approach it reports it pioneered more than 20 years ago. According to the company, concurrent free cooling reduces reliance on mechanical direct expansion cooling while improving part-load efficiency using electronically controlled fans, inverter-driven pumps, and centrifugal compressors. Airedale notes that variable-speed control can more closely match cooling output to thermal load to reduce energy use and component wear, and it states that electronically controlled fans are up to 70% more efficient than alternating current fans at part-load.
The company points to recent press announcements stating server racks can now be cooled with 45 C water, which Airedale says expands the operational window for free cooling and hybrid cooling as thermal density increases. Airedale also says its intelligent control systems can stage cooling to support transition from mechanical cooling to free cooling.
As an example, Airedale cites its Airedale Cooling System Optimizer, which it says can configure between two and 20 chillers to control a cooling block in its most efficient form. For sites running traditional air-cooled chillers alongside chillers with free cooling, the company says the Optimizer prioritizes free cooling across available units at low ambient temperatures while maintaining stable system water conditions.
“Airedale by Modine is well-positioned for the industry’s shift toward higher temperature and higher heat density thermal architectures,” said Art Laszlo, Group Vice President, Global Data Centers at Modine. “Alongside our air-cooled chillers with free cooling, we offer a full range of solutions including dry coolers, air handling units (AHU), coolant distribution units (CDU), and intelligent controls to optimize efficiency across diverse designs. We’re also advancing our immersion cooling capabilities to support the rising power densities of next-generation chips.”
Source: Modine
