NewPhotonics announces NPC50503 1.6T near-packaged optics chiplet for serviceable data center interconnect January 20, 2026
Airedale by Modine positions free-cooling chillers for high-temperature data center thermal architectures January 20, 2026
AFL launches Fujikura 100S fusion splicer and CT60 cleaver for faster data center fiber splicing January 20, 2026
Accelsius raises $65 million Series B to scale two-phase direct-to-chip liquid cooling for AI data centers January 20, 2026
Cadence ships LPDDR5X 9,600 Mbps memory IP with Microsoft RAIDDR ECC for data center reliability January 20, 2026
HRL Low-Chill single-phase liquid cooling targets high-density GPU racks with low pressure drop March 9, 2026
Accuenergy launches AcuRev 4100 branch-circuit submeter for data center power monitoring March 9, 2026
Baya Systems and Aion Silicon team up on SoC and chiplet interconnect and implementation March 3, 2026
Northstar and Bridgepointe partner on modular data center and in-line amplifier facilities March 3, 2026
