NewPhotonics announces NPC50503 1.6T near-packaged optics chiplet for serviceable data center interconnect January 20, 2026
Airedale by Modine positions free-cooling chillers for high-temperature data center thermal architectures January 20, 2026
AFL launches Fujikura 100S fusion splicer and CT60 cleaver for faster data center fiber splicing January 20, 2026
Accelsius raises $65 million Series B to scale two-phase direct-to-chip liquid cooling for AI data centers January 20, 2026
Cadence ships LPDDR5X 9,600 Mbps memory IP with Microsoft RAIDDR ECC for data center reliability January 20, 2026
TDK’s new B25696H film capacitors bring 30 nH ESL and 200,000-hour lifetime to SiC power converter designs June 8, 2026
