NewPhotonics announces NPC50503 1.6T near-packaged optics chiplet for serviceable data center interconnect January 20, 2026
Airedale by Modine positions free-cooling chillers for high-temperature data center thermal architectures January 20, 2026
AFL launches Fujikura 100S fusion splicer and CT60 cleaver for faster data center fiber splicing January 20, 2026
Accelsius raises $65 million Series B to scale two-phase direct-to-chip liquid cooling for AI data centers January 20, 2026
Cadence ships LPDDR5X 9,600 Mbps memory IP with Microsoft RAIDDR ECC for data center reliability January 20, 2026
