NewPhotonics has announced the NPC50503, a 1.6T near-packaged optics (NPO) laser-integrated transmitter chiplet with an integrated OSPic all-optical signal processor. It is positioned as a serviceable NPO solution designed to reduce power consumption while maintaining interoperability for high-speed connectivity in hyperscaler data center AI factories.
According to NewPhotonics, the NPC50503 targets NPO serviceability architectures and integrates a laser along with the company’s SmartPIC optical programmable photonic toolset. The company says this approach is intended to equalize electrical impairment and support small-form-factor co-packaging next to GPUs and AI accelerators.
NewPhotonics describes the device as a monolithic silicon photonic flip chip aimed at compact, power-optimized scale-up and scale-out interconnect. Key features listed by the company include heterogeneously integrated lasers with high coupling efficiency, a low-power flip-chip ball-grid array (BGA) package intended to simplify assembly, and 224 Gbps high-bandwidth PAM4 that the company states is IEEE 802.3dj-compliant. The company also lists an 8 dB radio-frequency (RF) link-budget improvement beyond a 21 dB long-channel baseline, plus per-channel output power monitoring, transmission-disable access, and a reference design for RF and optical integration.
“As AI systems push 200Gbps/lane and beyond, power efficiency, signal integrity, serviceability and operational control become imperative,” said Doron Tal, SVP and GM of NewPhotonics. “Our NPC50503 chiplet solution moves all the advanced optical domain advantages of our award-winning pluggable chip innovation directly adjacent to compute. This brings much needed NPO power efficiency in a modular and serviceable co-packaged answer to today’s system scalability and performance challenges.”
NewPhotonics says the NPC50503 1.6T NPO transmitter will be available for private demo at the Optical and Fiber Communications (OFC) conference in Los Angeles in March.
Source: NewPhotonics
