Tag: Co-Packaged Optics

ACON Optics shows CPO connectivity and 1.6T transceivers for AI data centers at Computex 2026

July 7, 2026

Optical interconnect R&D: Kopin to open Dallas photonics design center by 2026

July 2, 2026

PicoJool to sample 200G VCSELs next quarter for AI data centers

June 19, 2026

Optical module MCUs: GigaDevice launches GD32E512 (M33) and GD32E252 (M23)

June 19, 2026

Supermicro DCBBS blueprints scale NVIDIA Vera Rubin AI factories from 5MW to 1GW

June 17, 2026

Marvell starts sampling 102.4 Tbps AI data center switch silicon this quarter

June 16, 2026

Ayar Labs brings co-packaged optics to NVIDIA NVLink Fusion AI racks

June 9, 2026

Sarcina launches UCIe 2.0 packaging IP for 32 GT/s chiplet interconnects

May 22, 2026

Data center optical interconnect: InPHRED targets InP VCSEL and micro‑RC‑LED demos in 2027

May 14, 2026

GlobalFoundries launches OCI MSA-ready co-packaged optics module platform

May 13, 2026

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