Mixx Technologies has acquired Sophic Silicon Technologies and signed a manufacturing collaboration with Kaynes Semicon to support test and assembly for optical IC packaging tied to Mixx’s co-packaged optics roadmap. The moves pull more of Mixx’s co-packaged optics stack—analog mixed-signal IP through packaging and test—into India, with Sophic Silicon’s team and IP joining Mixx effective immediately.
The acquired company, Sophic Silicon Technologies, is a Bengaluru-based semiconductor IP design firm focused on analog mixed-signal design, including the electro-optic interface work Mixx is using in its co-packaged optics platform. Mixx said Sophic Silicon’s IP forms the electronic IC foundation of its HBxIO platform, which it describes as a “multi-terabit, ultra-high-radix optical interconnect architecture” aimed at large-scale AI inference and training.
For data center engineers, co-packaged optics matters because it’s one of the direct paths the industry is exploring to reduce the power and reach constraints of high-speed electrical I/O as bandwidth demand keeps climbing inside AI clusters. But the hard engineering work isn’t only photonics; it’s also the analog mixed-signal boundary between photonic engines and digital silicon. Bringing that capability in-house can tighten iteration loops between link design, packaging, test, and system integration—if Mixx can execute across those layers.
Mixx CEO Vivek Raghuraman said, “Our vision has always been to build the complete electronic-photonic stack. Sophic Silicon brings critical analog mixed-signal expertise that reinforces HBxIO and moves us closer to deploying optical connectivity at hyperscale.” Mixx also said Sophic Silicon’s founders and core engineers will join Mixx’s product development organization, and that Mixx will continue expanding its R&D operations in India.
Separately, Mixx’s collaboration with Kaynes Semicon is focused on building a dedicated test and assembly capability for next-generation optical integrated circuits, aligned to Mixx’s optical IC packaging roadmap. Kaynes Semicon is described as an OSAT provider with a facility in Sanand, Gujarat. Kaynes Semicon CEO Raghu Panicker called it a “multi-year collaboration” and said, “We have built the infrastructure and the process depth to support advanced optical IC packaging.”
Mixx said it is integrating Sophic Silicon’s mixed-signal IP across the HBxIO platform stack and that it is engaged with cloud service providers to qualify the platform across both scale-up and scale-out networking. It also said the Kaynes Semicon work is underway, with a focus on qualifying assembly and test processes intended to meet hyperscale performance and reliability requirements.
Mixx Technologies is headquartered in San Jose, California, and said it has R&D operations in India and Taiwan.
Source: Mixx Technologies
