Avicena has introduced the LightBundle eKit, an evaluation kit built around microLED-based optical interconnects aimed at AI infrastructure connectivity. The platform targets architects working on AI scale-in links (die-to-die and die-to-memory) as well as scale-up links (XPU-to-XPU and XPU-to-switch).
LightBundle eKit uses ASIC-based transceivers with integrated LED, photodetector (PD), and micro-lens arrays, coupled through a multi-core fiber bundle. Avicena’s pitch is straightforward: replace short-reach copper interconnects with microLED-based optical links, while eliminating lasers.
LightBundle eKit specs and platform details
Avicena lists the eKit’s physical-layer building blocks as 320 microLED data channels operating up to 3.5 Gbps. Of those, 256 channels are active and 64 are designated as spare channels for redundancy. Avicena puts the platform’s throughput at up to 896 Gbps, and says it is demonstrating 512 Gbps links.
On link quality, Avicena reports raw BER better than 10−9 without forward error correction at 512 Gbps. The kit supports 5 m and 10 m optical fiber connectivity.
The eKit includes host interface boards, reference drivers, integrated diagnostics, and a GUI driven by a customized software configuration and testing platform. Avicena says the tooling is intended to let engineers evaluate optical signal integrity, link budgets, open-eye monitoring, power efficiency, crosstalk, and bit error rate bathtub curves in their own labs.
Why data center engineers should care
Interconnect power and reach are now design constraints for AI systems, not just board-level details. If a laser-free optical approach can hold up in real lab measurements—and not just in a demo—it could change how teams think about short-reach optical links inside next-gen AI platforms. But the useful part here is the kit itself: it’s something engineers can plug into a test plan and compare against their existing copper or optical options using BER, crosstalk, and link budget data.
“LightBundle™ eKit gives system architects the first platform to evaluate microLED optical connectivity,” said Marco Chisari, CEO of Avicena. “Our customers and partners can now measure bit error rates, optical link budgets, crosstalk performance and power efficiency in their own engineering labs.”
Avicena says LightBundle eKit will be available to select early-access partners in March 2026, with broader availability planned for Q2 2026. The company also says it plans to support up to 896 Gbps throughput in Q2.
Source: Avicena
