Eoptolink has introduced a 12.8 Tbps XPO pluggable optical transceiver aimed at AI data centers, and it has joined the XPO Multi-Source Agreement (MSA) as a founding member. The combination matters for operators pushing bandwidth and panel density in GPU-heavy fabrics, where optics power dissipation is increasingly a mechanical and thermal design constraint, not just an electrical one.
The 12.8T XPO module is specified at 64 lanes running 200 Gbps each for 12.8 Tbps total throughput. Eoptolink also claims a front-panel density of 204.8 Tbps in a 4-RU rack with this form factor, and positions that as a 4x improvement versus current 1.6T OSFP solutions.
On the thermal side, the module integrates a cold plate rated to support up to 400 W of cooling per module. Liquid-cooled pluggable optics are a practical response to where the heat is generated: as per-port bandwidth climbs, module power goes up, and air-cooled front panels can become the limiting factor for how much bandwidth a switch can expose in a fixed RU envelope.
Eoptolink says the XPO architecture supports linear, half-retimed, and fully-retimed interfaces, targeting deployment flexibility across different link budgets and switch architectures.
“Liquid cooling enables higher-power optical modules while maintaining thermal efficiency, allowing much greater port density. At the same time, front-panel pluggability preserves the serviceability and deployment flexibility that operators rely on,” said Sean Davies, Vice President of Sales at Eoptolink.
Eoptolink also joined the XPO MSA as a founding member. The group is focused on defining a class of high-density, liquid-cooled pluggable optics, with Eoptolink contributing optical transceiver design and manufacturing expertise aimed at “development and commercialization” for AI infrastructure and cloud data centers.
Source: Eoptolink
