MACOM has introduced a 3.2T front-end chipset solution aimed at 448 Gbps PAM-4 optical links, targeting next-generation optical interconnects for AI infrastructure, cloud data centers, and high-speed networking. The company’s pitch is straightforward: deliver key transmit and receive building blocks from a single vendor to simplify development and qualification for 3.2T-class optical modules.
The chipset is designed to reach up to 3.2T aggregate throughput using eight channels running at 448 Gbps PAM-4. On the receive side, the platform combines MACOM photodiodes and transimpedance amplifiers (TIAs), while the transmit side uses the company’s previously introduced 448 Gbps PAM-4 driver devices.
For the receive chain, MACOM is pairing its MARP-BP224 backside-illuminated PIN photodiode with the MATA-42754 and MATA-41754 quad linear TIAs. The photodiode is optimized for 448 Gbps PAM-4 receiver applications and is specified at greater than 100 GHz bandwidth, with ultra-low parasitics intended to preserve signal integrity at these data rates. MACOM also says the device uses a proprietary design for high coupling efficiency and will be offered in multiple layouts to support different optical interface implementations.
The MATA-42754 and MATA-41754 TIAs are designed to meet bandwidth requirements for next-generation optical links and include RSSI functionality for photo alignment and power monitoring. They also add digital control of bandwidth, output amplitude, peaking, gain, and loss-of-signal thresholds. In practice, that set of controls matters because 448 Gbps PAM-4 pushes tight link budgets, and module designers typically need knobs to tune the receiver for real-world optics, packaging parasitics, and manufacturing variation.
On the transmit side, the receive solution is positioned as a complement to MACOM’s MAOM-025408 and MAOM-022404 driver solutions for 448 Gbps PAM-4 optical transmit architectures.
Stephen G. Daly, MACOM’s president and CEO, said, “MACOM’s 3.2T chipset solution has been engineered and optimized as a platform, helping customers optimize link performance while reducing development and qualification efforts.”
MACOM says products in the 3.2T chipset solution are readily available.
Source: MACOM
