Applied Optoelectronics selects ClassOne Solstice S8 system to boost AI data center server production

ClassOne Technology has announced the supply of its Solstice S8 single-wafer processing system to Applied Optoelectronics, a developer of optical components, to strengthen production of advanced optoelectronic devices for high-speed data and communication infrastructure. The system is intended to support Applied Optoelectronics’ ramp-up in manufacturing to meet increased demand from artificial intelligence data center applications.

According to ClassOne, the Solstice S8 platform will be configured for gold electroplating and single-wafer metal lift-off processes on three- and four-inch indium phosphide substrates. Indium phosphide substrates are integral to manufacturing high-performance optoelectronic devices, including laser diodes and optical transceivers, which power data center optical interconnects. The automated system is designed to optimize throughput and process uniformity specifically for high-volume environments.

Applied Optoelectronics reports that growth in generative artificial intelligence and high-speed data processing has led to exponential increases in optical interconnect requirements. The company has chosen to scale production using this system to address these rapidly evolving needs within data centers.

“The rapid ramp in demand from AI-driven data centers has made it essential for us to scale production efficiently while maintaining the highest possible device performance,” said Stephen Hu, deputy director of wafer and chip production at Applied Optoelectronics. “ClassOne’s Solstice S8 offers both the throughput and the process uniformity we need to support this growth with confidence.”

“The Solstice S8 is engineered for high-volume compound semiconductor processing, and its flexibility and automation make it ideal for critical steps like gold plating and metal lift-off on InP substrates,” said ClassOne CEO Byron Exarcos.

ClassOne Technology states that its platform is also in use for photonics, power, 5G, microLED, and sensor device manufacturing.

Source: ClassOne Technology

Get Data Center Engineering News In Your Inbox:

Popular Posts:

GmyybkpD3o7f45xka2pctu42nog
FS launches high-density 1U WDM platform for data centers, maximizing rack space and passive cooling
Screenshot
Knowles launches safety-certified high-voltage ceramic capacitors for data center applications
kbra-logo-new
KBRA assigns preliminary ratings to colocation data center ABS backed by 32 facilitie
pr-image-forcadence-and-samsung-foundry-expand-collaboration-to-accelerate-ai-data-center-chip-design-and-power-optimization-jpg
Cadence and Samsung Foundry expand collaboration to accelerate AI data center chip design and power optimization
Yokogawa-T&M---SL2000-high-speed-data-acquisition-unit
Yokogawa releases SL2000 high-speed data acquisition unit for multi-channel measurement and analysis applications

Share Your Data Center Engineering News

Do you have a new product announcement, webinar, whitepaper, or article topic? 

Get Data Center Engineering News In Your Inbox: