Applied Optoelectronics has introduced a 400-milliwatt narrow-linewidth pump laser designed for silicon photonics and co-packaged optics applications in artificial intelligence (AI) data centers. The company reports that this laser was developed to address performance limitations caused by broader linewidth or higher noise lasers and aims to deliver stable, high-performance light sources for next-generation optical networking.
According to Applied Optoelectronics, the new laser is intended for direct sourcing into semiconductor chip-scale systems, enabling hyperscale data center operators to support co-packaged optics, silicon photonics, and other demanding photonic applications. The device is also positioned as a high-efficiency external laser source capable of providing pump power to multiple optical communication channels.
Technical details provided by the company include deployment of a distributed feedback (DFB) design built on Applied Optoelectronics’ buried heterostructure laser platform, with a stable optical output exceeding 400 milliwatts at 50°C and maintaining a narrow linewidth.
Key operational highlights claimed by Applied Optoelectronics include supporting power budgets for 800 gigabit and 1.6 terabit optical modules by overcoming coupling, splitting, and routing losses within thermal constraints near AI switch application-specific integrated circuits (ASICs). The laser reportedly enables both shared and external laser source architectures by driving multiple silicon photonics lanes or wavelengths from a central source. Applied Optoelectronics also notes that the device is engineered to stabilize wavelength and noise performance in ring modulators, micro-ring lasers, and on-chip nonlinear elements, while reducing calibration requirements and supporting consistent lane-to-lane operation as systems scale.
Fred Chang, Senior Vice President and North American General Manager at Applied Optoelectronics, stated, “Sophisticated architectures need high performance optical sources. We have spent the last several years working on the specs to produce an ultra high-power laser that will meet the demands of optical networks today and specifically support the CPO architectures of the future,” “With this new technology, we are raising the bar on laser power, coherence, and stability to offer customers the ideal solution for unlocking scalable optical I/O, simplifying system design, and accelerating the industry’s transition to co-packaged optics at 800G and beyond.”
The company reports that samples are available to select customers, with full-scale production expected later in 2026.
Source: Applied Optoelectronics
