FS has announced the release of MMC cables and MMC panels, targeting rising optical density and performance challenges in AI-driven and hyperscale data centers. The product line is engineered to meet demands created by AI training clusters, GPU servers, and next-generation switches, which are driving rapid increases in optical port density and presenting mechanical and thermal challenges.
The MMC cables and panels feature a new Very Small Form Factor (VSFF) multi-fiber connector format. According to FS, this format delivers up to three times the density of traditional MPO-based solutions, optimizing space utilization in high-density data center environments. Each cable integrates the TMT Elite ferrule, an optimized core structure with a smaller form factor, reduced epoxy cavity, and symmetric geometry, achieving 0.35 dB insertion loss with angled physical contact (APC) polish to enhance return loss. All MMC cables are tested to meet Telcordia GR-1435 standards for reliability and optical signal integrity.
For installation and maintenance, the MMC cables incorporate Top and Bottom Rails to ensure correct polarity management, and the DirectConec push-pull boot supports rapid, safe manipulation during patching in dense cable trays.
The MMC portfolio supports a wide range of use cases, including structured cabling within data centers and direct high-bandwidth device interconnections. The product line also includes a 1U MMC fiber panel compatible with standard EIA 19-inch racks and cabinets, supporting MMC-12, MMC-16, or MMC-24 cables. The panel houses 66 four-port MMC adapters in a 1U height, supporting up to 6,336 fibers per panel when loaded with MMC-24 cables.
FS notes that the MMC cabling series is positioned to support next-generation, high-bandwidth data center architectures and operations.
Source: FS
