Go!Foton unveils high-density fiber optic connectivity solutions for data centers

Go!Foton has announced it will showcase its PEACOC 360 spooling fiber patch panel and high-density fiber connectivity products at the BICSI Beyond conference, taking place August 17-20, 2025, at The Venetian Resort and Expo in Las Vegas, Nevada. The PEACOC 360 panel, introduced earlier in 2025, is designed for space-constrained environments such as data centers and telecom facilities, and offers enhanced modularity, cable management, and scalability.

According to the company, the PEACOC 360 balances port density and fiber cable length with 96 fibers across 48 ports and 100 feet of integrated cable per reel. The 1 rack unit (RU) panel holds four 100-foot reels, claiming capacity to support over 60 percent of typical data center applications, compared to products limited to 45 feet per reel. The panel incorporates spreadable adapter technology to accelerate deployment and improve accessibility for installation and maintenance.

Brian Berdan, Product Manager at Go!Foton, commented: “PEACOC 360 accelerates deployments, reduces labor costs, and delivers unmatched scalability, reach, and accessibility for any fiber network. We’ve received tremendous feedback, particularly from services groups who appreciate not having labor hold-ups due to an imperfect run measurement, a procurement delay, or trouble managing an already crowded or messy application.”

The company will present its solutions at booth 401. Additionally, Go!Foton’s Shannon Wahl and Synfratech’s Zach Bowersox will present a session titled “Optimizing the Data Center in an era of High Demand and Limited Resources” on August 19, 2025, focusing on key optimization strategies for data center networks amid growing demand driven by artificial intelligence workloads.

Source: Go!Foton

Get Data Center Engineering News In Your Inbox:

Popular Posts:

695fcac850f073b041e711a2_karman-p-3200 copy
Karman launches 10 MW Heat Processing Unit for giga-scale AI data center cooling
Screenshot
Five AI data centers to reach 1 GW power capacity in 2026, new analysis shows
1600x1600_1
DCX announces 8.15 MW facility-scale CDU for 45 C warm-water AI data center cooling
Grafika3-scaled copy
DCX announces 8.15 MW coolant distribution unit for 45°C warm-water cooling in AI data centers
Multiple_Stack_with_Calipe_with_Light_Streak_2
Wolfspeed produces first 300mm silicon carbide wafer to boost data center power and cooling efficiency for AI servers

Share Your Data Center Engineering News

Do you have a new product announcement, webinar, whitepaper, or article topic? 

Get Data Center Engineering News In Your Inbox: