Infineon and Eaton are partnering on medium-voltage solid-state transformer technology aimed at AI data center power conversion, with Infineon supplying silicon carbide (SiC) power devices for Eaton’s MVSST 2.0 platform in APAC. The work is tied to 800 VDC data center power distribution architectures and the grid interconnect hardware needed to support them.
Under the collaboration, Infineon will deliver SiC power devices for Eaton’s medium-voltage solid-state transformer (MVSST) 2.0 platform, which Eaton has designed for deployment across APAC. The companies are tying the effort to improving the efficiency and reliability of power conversion required to connect AI data centers to the electricity grid, specifically in designs built around 800 VDC distribution.
Eaton’s MVSST 2.0 platform is described as reducing conversion stages compared with conventional architectures, with the goal of improving efficiency, power density, and deployment flexibility. For engineers, fewer conversion stages can translate into fewer loss points and potentially less thermal and space pressure inside the power train—but the real test will be how these systems perform at scale, under transient AI loads, and within utility interconnection constraints.
Eaton also says MVSST 2.0 is one of the first medium-voltage solid-state transformer platforms to achieve IEC certification. The platform combines SiC technology with Eaton’s power distribution and conversion experience, targeting next-generation energy infrastructure that can support high-density computing and emerging 800 VDC data center architectures.
For the next step, the companies said they’re exploring next-generation SST platforms based on 2.3 kV and 3.3 kV SiC power modules to support higher system voltages, higher efficiency, and improved reliability for future AI data centers, grid modernization, and renewable energy applications.
“By joining forces with Eaton, we aim to advance solid-state transformer technology and contribute to the development of a more scalable, efficient and sustainable infrastructure for powering the AI data centers of the future,” said Andreas Weisl, Executive Vice President and Chief Sales Officer of Industrial & Infrastructure at Infineon.
“Infineon’s advanced SiC technology is helping us accelerate the deployment of these next-generation power architectures,” said David Zheng, Vice President of R&D for Power Quality in APAC at Eaton.
Infineon and Eaton did not provide commercialization details beyond Infineon supplying SiC power devices for Eaton’s MVSST 2.0 deployments across APAC.
Source: Infineon
