Chroma — leaderboard

Integrated KGD screening test cell targets AI 2.5D/3D packages

Teradyne has introduced an integrated test cell aimed at known good device (KGD) screening for AI and data center devices, developed in collaboration with Tokyo Electron. The setup pairs the Teradyne UltraFLEXplus test platform with Tokyo Electron’s Prexa SDP (Singulated Device Prober) to support screening for advanced 2.5D and 3D packages.

The companies are targeting fabless designers, foundries, and OSATs that need device screening at multiple points in an advanced packaging flow. The combined system is intended for singulated device testing and is described as production-ready, with emphasis on thermal control, power density handling, and digital performance requirements associated with current AI and data center silicon.

KGD screening matters more as chiplet-based architectures push more value into a single package. With 2.5D and 3D assemblies integrating multiple die, one defective die can compromise the entire package, so screening earlier in the flow is a direct lever on yield protection and quality. For operators and hardware teams downstream, that can translate into fewer bad parts making it into expensive integration stages, where debug cycles and scrap get painful fast.

In the integrated cell, UltraFLEXplus instruments coordinate with the Prexa SDP prober, which maintains device temperature and manages high-power dissipation characteristics typical of leading-edge AI silicon. The solution is also described as built on an open ecosystem architecture, with flexibility across complementary probe cards, manipulators, and interface technologies, and the ability to integrate with other probers or testers as required.

“TEL’s industry-leading Prexa SDP, combined with Teradyne’s UltraFLEXplus, gives customers a production-ready solution that covers singulated device testing with the thermal precision, power density, and digital performance that today’s AI and data center devices require,” said Shannon Poulin, president of the Semiconductor Test Group at Teradyne.

Teradyne and Tokyo Electron said the integrated solution is commercially available.

Source: Teradyne

Chroma — below posts

Get Data Center Engineering News In Your Inbox:

By subscribing, you agree to our Privacy Policy and Terms of Use. You can unsubscribe at any time.

Sponsored: Infineon at OCP 2026: Exclusive Content Hub. Executive interviews, technical documents, reference designs, and live expert panel. Unlock the hub.
Chroma — tower

Popular Posts:

Frontale_(sh)
Mitsubishi Electric launches 1.75 MW magnetic-bearing air-cooled chiller for AI data centers
tranetechnologies
Trane demos 800 VDC chiller for AI data centers, 3.5 MW cooling capacity
Dr. Fanny Björk, Infineon — Microseconds, not milliseconds
Grid to core: the case for shifting to DC-grids
npc50506-6-4t-optical-engine-ch
NewPhotonics adds integrated-laser 6.4T near-package optics engine chipset
Screenshot 2026-09-30 at 10.33
Liquid leak detection flex assembly targets AI and HPC liquid cooling

Share Your Data Center Engineering News

Do you have a new product announcement, webinar, whitepaper, or article topic? 

TDK — tower ()

Get Data Center Engineering News In Your Inbox:

By subscribing, you agree to our Privacy Policy and Terms of Use. You can unsubscribe at any time.

TDK — leaderboard ()