Tag: Memory & HBM

SK hynix ships 12-stack HBM4E samples with 16 Gbps per pin for AI data centers

July 9, 2026

AMD buys MEXT for AI-driven memory optimization that makes flash act like DRAM

July 7, 2026

Qualcomm Dragonfly roadmap adds AI300 inference, HBC memory, C1000 CPU

June 26, 2026

HPE ProLiant DL394 Gen12 uses NVIDIA Vera CPU for agentic AI, due fall 2026

June 17, 2026

Samsung ships 12-layer HBM4E samples with up to 16Gbps pin speed

June 16, 2026

Gigabyte debuts X870E/X870 AORUS INFINITY boards with X3D Turbo Mode 2.0

June 16, 2026

Agilex 9 Direct RF SoC FPGA samples add 40% compute per mm²

June 11, 2026

Integrated KGD screening test cell targets AI 2.5D/3D packages

June 11, 2026

SK hynix iHBM embeds cooling elements in HBM package, cuts thermal resistance 30%

May 29, 2026

Cadence and TSMC expand certified design flows for N3, N2, A16 and A14 AI silicon

May 25, 2026

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July 9, 2026

STI launches fire-rated pathway for high-fill data and power cable trays

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SK hynix ships 12-stack HBM4E samples with 16 Gbps per pin for AI data centers

July 9, 2026

Kioxia ships 10th-gen BiCS FLASH 1Tb TLC NAND samples at 4.8 Gb/s

July 9, 2026

LONGWELL biomimetic EC fan targets 73–82% static efficiency, 4–6 dB(A) less noise

July 8, 2026