SK hynix has launched iHBM, a thermal solution for high-bandwidth memory (HBM) that embeds integrated cooling elements (ICEs) inside the HBM package. The goal is to improve heat dissipation in next-generation HBM products as stacking and interface speeds increase to meet AI processing demand.
The company is targeting a specific hot spot: the Die-to-Die Physical Layer (D2D PHY), the interface that connects HBM and the GPU. SK hynix points to power density in the D2D PHY as a key limiter for next-generation HBM, and iHBM is designed to pull heat out of that area more directly than prior package approaches.
Traditional HBM thermal paths generally move heat away indirectly through the core die. With iHBM, SK hynix places ICEs directly in the D2D PHY area—where it says heat concentration is highest—creating an additional heat dissipation path. SK hynix reports the approach reduces thermal resistance by 30% and allows chips to operate stably under high-temperature and high-pressure conditions.
From a data center engineering perspective, anything that reduces thermal resistance at the package level can translate into more headroom for sustained GPU utilization. But the practical value will depend on how those package-level gains show up at the module and system level, especially in platforms already pushing tight thermal budgets.
SK hynix says its wafer level packaging (WLP) process, based on its Mass Reflow Molded Underfill (MR-MUF) technology, supports stable high-volume production of iHBM-equipped chips. The company also says the design is compatible with existing System-in-Package (SiP) architectures, aiming to minimize the amount of redesign required to adopt the new thermal approach.
iHBM is slated for deployment in next-generation HBM products, including HBM5, with SK hynix linking the technology to improved stability and operational efficiency for HPC and AI data centers operating in high-density, high-bandwidth environments.
“iHBM is an optimal solution for thermal management, combining our memory design capabilities with advanced packaging technology,” said Kangwook Lee, Senior Vice President and Head of PKG Development at SK hynix.
Source: SK hynix
