The semiconductor industry’s premier symposium on high-performance processors and integrated circuits. Two tutorials, two keynotes, and roughly 25 detailed presentations from the chip architects at AMD, Intel, NVIDIA, Google, and others.

Every new chip architecture presented at Hot Chips defines the TDP, cooling requirements, and power delivery specs that data center engineers must design around. This is where you learn what’s coming to your racks 12-24 months from now — and what it’ll demand from your infrastructure.

Produced by: IEEE and Stanford University
Format: 3-day symposium with invited talks (no trade show)
Focus: Processor architecture, AI accelerators, GPUs, domain-specific chips, memory tech, 3D packaging, power/thermal management, emerging architectures (neuromorphic, quantum, photonic)
Audience: Chip architects, hardware engineers, semiconductor researchers