Company: Samsung Electronics

Samsung starts mass production and customer shipments of HBM4 for AI data center accelerators

February 24, 2026

Renesas launches 9600 MT/s Gen6 DDR5 clock driver for data center memory

November 17, 2025

AIEEV launches Air Cloud distributed GPU platform for AI inference

October 20, 2025

Montage Technology unveils CXL 3.1 memory expander controller for advanced data center servers

September 1, 2025

Chemours Opteon immersion cooling fluid qualified for Samsung data center SSDs

August 13, 2025

Cadence and Samsung Foundry expand collaboration to accelerate AI data center chip design and power optimization

June 24, 2025

Get Data Center Engineering News In Your Inbox:

By subscribing, you agree to our Privacy Policy and Terms of Use. You can unsubscribe at any time.

Share Your Data Center Engineering News

Do you have a new product announcement, webinar, whitepaper, or article topic?

Engineering Deep Dives

Designing for 100X: when speed wins, reliability starts to give

A closer look at power integrity at AI scale

Testing the weak spots in liquid-cooled server racks: design the connection like it’s the product

Latest Data Center Engineering News

AI data center energy performance framework released by NEMA, ASHRAE, PNNL

June 23, 2026

Edgecore deploys 100G/400G SONiC switches for HyperVerge AI and storage

June 23, 2026

Vertiv acquisition adds ThermoKey dry coolers and heat exchangers for AI data centers

June 23, 2026

Open-source edge gateway Z1 adds OpenLAN management from WAN to Wi‑Fi client

June 22, 2026

AI data center energy performance framework ties standards to deployment

June 22, 2026

Vertiv Rack Extreme boosts AI rack load ratings to 4,500 lb mobile capacity

June 22, 2026

GaN power portfolio GaNEXUS samples 40V–650V FETs for AI data centers

June 19, 2026

PicoJool to sample 200G VCSELs next quarter for AI data centers

June 19, 2026