Magnachip Semiconductor has released two 650 volt super junction metal-oxide-semiconductor field-effect transistors (SJ MOSFETs) built with a TO-Leadless (TOLL) package configuration. Magnachip claims these new products are targeted for premium consumer electronics as well as high-power and high-current systems, and has announced additional TOLL products are in development specifically for artificial intelligence (AI) data centers.
According to Magnachip, these 650 volt SJ MOSFETs feature a 4-pin Kelvin configuration, in contrast to the company’s previous TOLL-packaged eXtreme Trench MOSFETs, which use a 3-pin setup. The 4-pin design is reported to minimize parasitic inductance on the gate-source return path, which improves switching stability and power efficiency by reducing gate ringing.
The company states that, compared to conventional D2PAK packages, the new 4-pin TOLL package more than doubles the current capability, reduces the footprint by 24 percent, and lowers the package height by 48 percent. This package makes the MOSFETs suitable for high-power density applications that have strict requirements for power efficiency and thermal performance, which are necessary for smaller printed circuit boards.
Magnachip specifically identifies AI data centers as a future target market for 600 volt TOLL package devices and high-power applications. The devices are also positioned for premium TVs, gaming monitors, and AI laptop adapters and chargers.
“Our new 650V SJ MOSFET TOLL products are designed to meet both PCB space-saving and high-performance requirements of slim form-factor applications,” said Hyuk Woo, CTO of Magnachip. “Magnachip will continue to expand its 600V TOLL package product lineup in the near future to support new-generation products for AI datacenters and high-power applications.”
Source: Magnachip Semiconductor
